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HS-26CT31RH-T
Data Sheet July 1999 File Number
4590.1
Radiation Hardened Quad Differential Line Driver
Intersil's Satellite Applications FlowTM (SAF) devices are fully tested and guaranteed to 100kRAD total dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers, while maintaining a high level of reliability. The Intersil HS-26CT31RH-T is a Quad Differential Line Driver designed for digital data transmission over balanced lines and meets the requirements of EIA Standard RS-422. Radiation Hardened CMOS processing assures low power consumption, high speed, and reliable operation in the most severe radiation environments. The HS-26CT31RH-T accepts TTL inputs and converts them to RS-422 compatible outputs. This circuit uses special outputs that enable the drivers to power down without loading down the bus. Enable and disable pins allow several devices to be connected to the same data source and addressed independently.
Features
* QML Class T, Per MIL-PRF-38535 * Radiation Performance - Gamma Dose . . . . . . . . . . . . . . . . . . . . 1 x 105 RAD(Si) - SEU and SEL . . . . . . . . . . Immune to 100MeV/mg/cm2 * EIA RS-422 Compatible Outputs (Except for IOS) * TTL Compatible Inputs * High Impedance Outputs when Disabled or Powered Down * Low Power Dissipation 2.75mW Standby (Max) * Single 5V Supply * Low Output Impedance 10 or Less * Full -55oC to 125oC Military Temperature Range
Pinouts
HS1-26CT31RH-T (SBDIP), CDIP2-T16 TOP VIEW
AIN 1 16 VDD 15 DIN 14 DO 13 DO 12 ENABLE 11 CO 10 CO 9 CIN
Specifications
Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the HS-26CT31RH-T are contained in SMD 5962-95632. A "hot-link" is provided from our website for downloading. www.intersil.com/spacedefense/newsafclasst.asp Intersil's Quality Management Plan (QM Plan), listing all Class T screening operations, is also available on our website. www.intersil.com/quality/manuals.asp
AO 2 AO 3 ENABLE 4 BO 5 BO 6 BIN 7 GND 8
HS9-26CT31RH-T (FLATPACK), CDFP4-F16 TOP VIEW
AIN 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD DIN DO DO ENABLE CO CO CIN
Ordering Information
ORDERING NUMBER 5962R9563201TEC HS1-26C31RH/Proto 5962R9563201TXC HS9-26C31RH/Proto PART NUMBER HS1-26CT31RH-T HS1-26C31RH/Proto HS9-26C31RH-T HS9-26C31RH/Proto TEMP. RANGE (oC) -55 to 125 -55 to 125 -55 to 125 -55 to 125
AO AO ENABLE BO BO BIN GND
NOTE: Minimum order quantity for -T is 150 units through distribution, or 450 units direct.
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999 Satellite Applications FlowTM (SAF) is a trademark of Intersil Corporation.
HS-26CT31RH-T Functional Diagram
ENABLE ENABLE DIN CIN BIN AIN
DO DO
CO CO
BO BO
AO AO
TRUTH TABLE DEVICE POWER ON/OFF ON ON ON ON ON OFF (0V) INPUTS ENABLE 0 1 X 1 X X ENABLE 1 X 0 X 0 X IN X 0 0 1 1 X OUTPUT OUT HI-Z 0 0 1 1 HI-Z OUT HI-Z 1 1 0 0 HI-Z
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HS-26CT31RH-T Die Characteristics
DIE DIMENSIONS: 2450m x 4950m x 533m 25.4m (97 x 195 x 21mils 1mil) METALLIZATION: M1: Mo/Tiw Thickness: 5800A M2: Al/Si/Cu Thickness: 10kA 1kA SUBSTRATE POTENTIAL: Internally connected to VDD. May be left floating. BACKSIDE FINISH: Silicon PASSIVATION: Type: SiO2 Thickness: 8kA 1kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 285 PROCESS: Radiation Hardened CMOS, AVLSI
Metallization Mask Layout
HS-26CT31RH
(16) VDD (16) VDD (15) DIN (14) DO (13) DO (12) ENABLE (11) CO (10) CO CIN (9) (1) AIN AO (2) AO (3) ENABLE (4) BO (5) BO (6)
GND (8)
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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GND (8)
BIN (7)

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